Home / Technology
Technological possibilities large-scale production
Small drilling diameter
0.2mm
Max. Blank thickness / diameter ratio (aspect ratio)
up to 12 : 1
Blind holes (mechanically drilled)
Blind holes (lasered)
75 – 150 µm, approx. 1:1 aspect ratio (depending on prepreg type)
Thinnest inner layer material
50 µm (thinnest plated-through inner layer 150 µm incl. copper)
Lowest multilayer thickness
6-ply: 0.65 mm
Max. Thickness
3.2 mm
Iso distances
Special technology
- HDI/SBU up to 4
- Microvia layers (4+x+4)
Microvia filling - Hole-plugging method (buried holes filled with resin)
- Bondable surfaces for COB (own bonding laboratory for surface testing)
- Impedance-controlled printed circuit boards for high-frequency applications
- Hybrid technology, combination of different materials (e.g. Teflon/FR4)
- Depth milling, e.g. for the vertical integration of components
- Thermal management, e.g. thick copper technology up to 210 μm
- Rigid-flex circuits with selected superstructuresa
Milestones - Technology
1994
Introduction Surface:
Electroless nickel/gold
1999
Introduction of SBU technology
Microvias mechanically drilled
2008
Installation of a new electroless nickel/gold plant
(2nd generation)
2012
Installation of an LDI imagesetter to improve image transfer
2014
Commissioning of a resource-conserving energy supply (CHP, efficient cooling machines and low-emission gas heating systems)
2015
Installation of a modern horizontal through-hole plating system
2018
Expansion of in-house microvia filling capacity and technologies
2019
Expansion of digitization
Image transfer
2020
Digitization of solder resist process
2022
Capacity expansion
